Indian defence engineering company Paras Defence and Space Technologies said on Wednesday that its semiconductor unit would invest 62 billion rupees ($643.79 million) to set up a chip packaging and testing facility in the central Indian state of Madhya Pradesh.
Here are some details:
Paras Semiconductors, a subsidiary of the company, signed a memorandum of understanding with the Madhya Pradesh government's department of science and technology to jointly set up an outsourced semiconductor assembly and test (OSAT) facility in the Indore-Ujjain region.
An OSAT plant packages, assembles and tests foundry-made silicon wafers, turning them into finished semiconductor chips.
The facility will undertake advanced chip packaging operations and test the packaged chips for reliability, the company said.
-Reuters
Here are some details:
Paras Semiconductors, a subsidiary of the company, signed a memorandum of understanding with the Madhya Pradesh government's department of science and technology to jointly set up an outsourced semiconductor assembly and test (OSAT) facility in the Indore-Ujjain region.
An OSAT plant packages, assembles and tests foundry-made silicon wafers, turning them into finished semiconductor chips.
The facility will undertake advanced chip packaging operations and test the packaged chips for reliability, the company said.
-Reuters
