LANKAPAK 2026 to bring global packaging industry to Colombo

Sri Lanka’s premier international Packaging, Printing, Paper, Plastics and Converting Exhibition, LANKAPAK 2026, will be held from October 23 to 25 at the BMICH, Colombo, bringing local and international industry players together to showcase technologies, products and solutions.

Organised by the Sri Lanka Institute of Packaging (SLIP) in collaboration with CDC Events, the 27th edition will feature more than 160 exhibition stalls representing over 80 companies from Sri Lanka and overseas, including China, India, Pakistan, Maldives and other South Asian countries.

The exhibition will provide a platform connecting technology providers, manufacturers, exporters, suppliers, buyers and professionals across the packaging, printing, paper, plastics and converting sectors.

With international markets placing increasing emphasis on sustainability, recyclability, safety and quality standards, LANKAPAK 2026 will provide Sri Lankan businesses with opportunities to explore new technologies and sustainable solutions while gaining insights into changing global market requirements.

Held concurrently on October 23 and 24, the SLIP Annual Packaging Congress 2026 will be conducted under the theme “Rewriting Packaging in the New Global Economic Landscape.” The Congress will bring together industry leaders, academics, policymakers and professionals to discuss sustainability, innovation, emerging technologies and evolving international market requirements.

The Packaging Clinic will provide practical guidance on packaging design, material selection, standards, product development, sustainability and export readiness, while Daily Tech Forum sessions will focus on emerging technologies, innovative materials and global industry trends.

SLIP President Nishan Perera said LANKAPAK 2026 was more than an exhibition and would serve as a platform for the continued development of Sri Lanka’s packaging industry.

“Our focus is on connecting local businesses, particularly manufacturers, exporters and SMEs, with the technologies, knowledge and partnerships they need to grow and compete,” he said.

The exhibition is supported by KWO Printing Needs (Pvt.) Ltd. as Principal Sponsor, Polydime Plastics (Pvt.) Ltd. as Platinum Sponsor, Petro Packaging (Pvt.) Ltd. and Advanced Printing Technologies (Pvt.) Ltd. as Gold Sponsors, and FMJ Holdings and CMC Engineering Export GmbH as Silver Sponsors.

Kumar Welengoda, Managing Director, KWO Printing Needs, said the company was proud to support a platform that advances innovation and excellence in Sri Lanka’s packaging industry.

Johann Tranchell, Director, Polydime International, said the LANKAPAK exhibitions had enabled the Polydime Group to deliver innovative and sustainable packaging solutions combining performance, quality and technology.

The SLIP Annual Packaging Congress is supported by Snackings (Pvt.) Ltd. as Diamond Sponsor and Polymer Colour (Pvt.) Ltd. as Gold Sponsor.

Industry professionals, manufacturers, exporters, SMEs, entrepreneurs and other stakeholders are invited to attend LANKAPAK 2026 and participate in the exhibition, Congress, Packaging Clinic and technical knowledge-sharing programmes.

Picture: Imran Hassan, CEO/Managing Director, CDC Events; Lakshan Pethiyagoda, Co-Chairperson, LANKAPAK 2026; Deshantha Silva, Chairman, LANKAPAK 2026; Thilaka Jayasundara, Secretary, Ministry of Industry; Kumar Welengoda, Managing Director, KWO Printing Needs; and Nishan Perera, President, Sri Lanka Institute of Packaging.