India steps up chip race with new $644 million facility

Indian defence engineering company Paras Defence and Space ​Technologies said on Wednesday that ‌its semiconductor unit would invest 62 billion rupees ($643.79 million) to set ​up a chip packaging ​and testing facility in the ⁠central Indian state of ​Madhya Pradesh.

Here are some details:

Paras Semiconductors, ​a subsidiary of the company, signed a memorandum of understanding with ​the Madhya Pradesh government's department ​of science and technology to jointly ‌set ⁠up an outsourced semiconductor assembly and test (OSAT) facility in the Indore-Ujjain region.

An OSAT plant packages, ​assembles ​and tests ⁠foundry-made silicon wafers, turning them into finished ​semiconductor chips.

The facility will ​undertake ⁠advanced chip packaging operations and test the packaged chips for ⁠reliability, ​the company said.

-Reuters